US Patent Application 18334381. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Wensen Hung of Hsinchu County (TW)
Ping-Kang Huang of Chiayi City (TW)
Tsung-Yu Chen of New Taipei City (TW)
Tsung-Shu Lin of Hsinchu City (TW)
Chien-Yuan Huang of Hsinchu (TW)
Chen-Hsiang Lao of New Taipei City (TW)
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18334381 Titled 'SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF'
Simplified Explanation
The abstract describes a semiconductor structure that consists of a circuit substrate, a semiconductor die, and a cover. The semiconductor die is placed on the circuit substrate, and the cover is placed over both the semiconductor die and the circuit substrate. The cover is made up of a lid portion and a support portion. The structure is held together by a first adhesive that bonds the support portion to the circuit substrate, and a second adhesive that bonds the support portion to the lid portion.
Original Abstract Submitted
A semiconductor structure includes a circuit substrate, a semiconductor die, and a cover. The semiconductor die is disposed on the circuit substrate. The cover is disposed over the semiconductor die and over the circuit substrate. The cover comprises a lid portion and a support portion. The structure includes a first adhesive bonding the support portion to the circuit substrate and a second adhesive bonding the support portion and the lid portion.
