US Patent Application 18334181. CHEMICAL MECHANICAL POLISHING CLEANING SYSTEM WITH TEMPERATURE CONTROL FOR DEFECT REDUCTION simplified abstract
Contents
CHEMICAL MECHANICAL POLISHING CLEANING SYSTEM WITH TEMPERATURE CONTROL FOR DEFECT REDUCTION
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Ying-Tsung Chen of Hsinchu (TW)
Gin-Chen Huang of Hsinchu (TW)
CHEMICAL MECHANICAL POLISHING CLEANING SYSTEM WITH TEMPERATURE CONTROL FOR DEFECT REDUCTION - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18334181 Titled 'CHEMICAL MECHANICAL POLISHING CLEANING SYSTEM WITH TEMPERATURE CONTROL FOR DEFECT REDUCTION'
Simplified Explanation
The abstract describes a cleaning system that is used after a chemical mechanical polishing (CMP) process to remove contaminants from a substrate. The system includes a cleaning module that receives the substrate and uses a cleaning solution to remove the contaminants. There is also a cleaning solution supply system that provides the cleaning solution to the cleaning module. This supply system includes a temperature control system, which consists of a heating device to heat the cleaning solution, a cooling device to cool the cleaning solution, a temperature sensor to monitor the temperature of the cleaning solution, and a temperature controller to control the heating and cooling devices.
Original Abstract Submitted
A cleaning system includes at least one cleaning module configured to receive a substrate after a chemical mechanical polishing (CMP) process and to remove contaminants on the substrate using a cleaning solution. The cleaning system further includes a cleaning solution supply system configured to supply the cleaning solution to the at least one cleaning module. The cleaning solution supply system includes at least one temperature control system. The at least one temperature control system includes a heating device configured to heat the cleaning solution, a cooling device configured to cool the cleaning solution, a temperature sensor configured to monitor a temperature of the cleaning solution, and a temperature controller configured to control the heating device and the cooling device.
