US Patent Application 18332990. Semiconductor Die Connection System and Method simplified abstract
Contents
Semiconductor Die Connection System and Method
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Ming-Fa Chen of Taichung City (TW)
Sen-Bor Jan of Tainan City (TW)
Semiconductor Die Connection System and Method - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18332990 Titled 'Semiconductor Die Connection System and Method'
Simplified Explanation
The abstract describes a system and method for connecting semiconductor dies. It explains that a first semiconductor die with a smaller width is connected to a second semiconductor die with a larger width, which is still connected to a semiconductor wafer. The first semiconductor die is then encapsulated and thinned to expose a through substrate via. The second semiconductor die is separated from the wafer, and the combined first and second semiconductor dies are connected to another substrate.
Original Abstract Submitted
A system and method for connecting semiconductor dies is provided. An embodiment comprises connecting a first semiconductor die with a first width to a second semiconductor die with a larger second width and that is still connected to a semiconductor wafer. The first semiconductor die is encapsulated after it is connected, and the encapsulant and first semiconductor die are thinned to expose a through substrate via within the first semiconductor die. The second semiconductor die is singulated from the semiconductor wafer, and the combined first semiconductor die and second semiconductor die are then connected to another substrate.
