US Patent Application 18328913. PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract

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PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.


Inventor(s)

Po-Chen Lai of Hsinchu County (TW)


Chin-Hua Wang of New Taipei City (TW)


Ming-Chih Yew of Hsinchu City (TW)


Li-Ling Liao of Hsinchu City (TW)


Tsung-Yen Lee of Changhua County (TW)


Po-Yao Lin of Hsinchu County (TW)


Shin-Puu Jeng of Po-Shan Village (TW)


PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME - A simplified explanation of the abstract

  • This abstract for appeared for US patent application number 18328913 Titled 'PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME'

Simplified Explanation

The abstract describes a package structure that consists of several components. Firstly, there is a semiconductor die that is bonded to a redistribution structure using first bonding elements. Secondly, there is a wall structure that is also bonded to the redistribution structure using second bonding elements. The wall structure is made up of multiple partitions arranged in a ring shape, but with gaps in between. The semiconductor die is placed within this ring. Lastly, there is a substrate that is bonded to the other side of the redistribution structure using third bonding elements. The substrate is also electrically connected to the semiconductor die.


Original Abstract Submitted

A package structure is provided. The package structure includes a semiconductor die bonding on a first surface of a redistribution structure through first bonding elements, and a wall structure bonding on the first surface of the redistribution structure through second bonding elements. The wall structure includes a plurality of partitions laterally arranged in a discontinuous ring, and the semiconductor die is located within the discontinuous ring. The package structure also includes a substrate on a second surface of the redistribution structure through third bonding elements and in electrical connection with the semiconductor die

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