US Patent Application 18326325. SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Inventors
YANGGYOO Jung of GWANGMYEONG-SI (KR)
JINHYUN Kang of CHEONGJU-SI (KR)
SANGMIN Yong of CHEONAN-SI (KR)
SEUNGKWAN Ryu of SEONGNAM-SI (KR)
SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- This abstract for appeared for patent application number 18326325 Titled 'SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE'
Simplified Explanation
This abstract describes a semiconductor package that includes a package substrate and an interposer. The interposer is placed on top of the package substrate and consists of a semiconductor substrate with a wiring layer on its upper surface. The wiring layer contains multiple wirings, and there are redistribution wiring pads on top of it that are connected to these wirings. Additionally, bonding pads are present on the redistribution wiring pads. An insulation layer pattern is also included, which exposes a portion of the bonding pad. The interposer accommodates two semiconductor devices, which are positioned apart from each other. These devices are connected to each other through the wirings present in the interposer.
Original Abstract Submitted
A semiconductor package includes a package substrate. An interposer is disposed on the package substrate. The interposer includes a semiconductor substrate, a wiring layer disposed on an upper surface of the semiconductor substrate and having a plurality of wirings therein, redistribution wiring pads disposed on the wiring layer and electrically connected to the wirings, bonding pads disposed on the redistribution wiring pads, and an insulation layer pattern disposed on the wiring layer and exposing at least a portion of the bonding pad, and first and second semiconductor devices disposed on the interposer. The first and second semiconductor devices are spaced apart from each other and are electrically connected to each other by at least one of the wirings.
