US Patent Application 18324272. Injection Molding Device And Molding Tool simplified abstract

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Injection Molding Device And Molding Tool

Organization Name

SEIKO EPSON CORPORATION

Inventor(s)

Takuro Fushimi of Matsumoto (JP)

Hiroyuki Kato of Shiojiri (JP)

Injection Molding Device And Molding Tool - A simplified explanation of the abstract

This abstract first appeared for US patent application 18324272 titled 'Injection Molding Device And Molding Tool

Simplified Explanation

The patent application describes an injection molding device that includes a stationary mold and a movable mold.

  • The device has two gate openings for injecting different molding materials into a cavity.
  • A cooler is used to cool the stationary mold.
  • The end surface of the stationary mold has two regions - a first region between the gate openings and a second region.
  • The cooler is designed to provide higher cooling performance to the first region compared to the second region.


Original Abstract Submitted

An injection molding device includes a stationary mold provided with a first gate opening, and a second gate opening, a movable mold configured to be mold-clamped against the stationary mold, a first hot runner configured to inject a first molding material in a cavity compartmented by the stationary mold and the movable mold, via the first gate opening, a second hot runner configured to inject a second molding material in the cavity via the second gate opening, and a cooler configured to cool the stationary mold. An end surface of the stationary mold opposed to the movable mold has a first region located between the first gate opening and the second gate opening, and a second region different from the first region. The cooler is configured so that a cooling performance with respect to the first region becomes higher than a cooling performance with respect to the second region.