US Patent Application 18323618. SUBSTRATE PROCESSING APPARATUS simplified abstract

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SUBSTRATE PROCESSING APPARATUS

Organization Name

TDK CORPORATION

Inventor(s)

Yohei Sato of Tokyo (JP)

Hiroshi Koizumi of Tokyo (JP)

Toshinobu Miyagoshi of Tokyo (JP)

Osamu Shindo of Tokyo (JP)

Seijiro Sunaga of Tokyo (JP)

Makoto Yamashita of Tokyo (JP)

Yasuo Kato of Tokyo (JP)

Mitsuyoshi Makida of Tokyo (JP)

Masashi Matsumoto of Tokyo (JP)

SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18323618 titled 'SUBSTRATE PROCESSING APPARATUS

Simplified Explanation

The patent application describes a substrate processing apparatus that includes a lower jig plate and a support member.

  • The lower jig plate is used to arrange a substrate that will be pressurized.
  • The support member has an installation portion where columnar members are installed to support the lower jig plate.
  • The columnar members are placed in the installation portion based on the in-plane distribution of the load applied to the lower jig plate.
  • The purpose of this arrangement is to provide efficient support for the substrate during processing.
  • This design helps to evenly distribute the load on the lower jig plate, ensuring uniform pressure on the substrate.
  • The substrate processing apparatus aims to simplify the processing of substrates and improve the overall efficiency of the process.


Original Abstract Submitted

A substrate processing apparatus having a lower jig plate for arranging a substrate as an object to be pressurized, a support member including an installation portion for installing columnar members supporting the lower jig plate , in which the columnar members are placed to the installation portion in accordance with a in-plane distribution of a load applied to the lower jig plate