US Patent Application 18322855. SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD simplified abstract

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SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD

Organization Name

Tokyo Electron Limited

Inventor(s)

Yoshiki Okamoto of Koshi City (JP)

Akihiro Kubo of Koshi City (JP)

Yasushi Takiguchi of Koshi City (JP)

SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18322855 titled 'SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD

Simplified Explanation

The patent application describes a substrate cleaning apparatus that is used to clean a substrate.

  • The apparatus includes a holder to hold the substrate securely.
  • It also includes a circular ring-shaped body with grooves formed in a radial shape at the top, each groove having a bottom on the body.
  • The top surface of the circular ring-shaped body acts as a sliding surface and is designed to slide on the bottom surface of the substrate.
  • A supporting body is used to support and rotate the circular ring-shaped body in a circular motion.
  • A cleaning liquid supply is provided to allow a cleaning liquid to be absorbed into the circular ring-shaped body.
  • A relatively moving mechanism is used to move the substrate and the supporting body relative to each other while the sliding surface, which has absorbed the cleaning liquid, presses against the bottom surface of the substrate.


Original Abstract Submitted

A substrate cleaning apparatus includes a holder configured to hold a substrate; a circular ring-shaped body; grooves formed in a radial shape at an upper portion of the circular ring-shaped body, each groove having a bottom located on the circular ring-shaped body; a sliding surface which is a top surface of the circular ring-shaped body between the respective grooves, and configured to be slid on a bottom surface of the substrate; a supporting body configured to support and rotate the circular ring-shaped body in a circumferential direction; a cleaning liquid supply configured to allow a cleaning liquid to be absorbed into the circular ring-shaped body; and a relatively moving mechanism configured to move the substrate and the supporting body relative to each other in a state that the sliding surface being rotated and having absorbed the cleaning liquid presses the bottom surface of the substrate.