US Patent Application 18321937. METHOD FOR MANUFACTURING MOLDING DIE, AND MOLDING DIE simplified abstract

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METHOD FOR MANUFACTURING MOLDING DIE, AND MOLDING DIE

Organization Name

SEIKO EPSON CORPORATION

Inventor(s)

Tatsuya Tsuboi of Okaya, Nagano (JP)

METHOD FOR MANUFACTURING MOLDING DIE, AND MOLDING DIE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18321937 titled 'METHOD FOR MANUFACTURING MOLDING DIE, AND MOLDING DIE

Simplified Explanation

- The patent application describes a method for manufacturing a molding die used in injection molding. - The method involves plasticizing a material that contains metal particles and resin to create a plasticized material. - The plasticized material is then dispensed onto a stage to stack layers on top of each other, creating a laminate that forms at least a portion of the molding die. - The metal particles in the plasticized material have an average particle diameter of 23 μm or smaller. - The innovation lies in the use of metal particles in the plasticized material, which helps improve the properties and performance of the molding die. - The smaller particle size of the metal particles allows for more precise and detailed molding. - This method offers a more efficient and cost-effective way to manufacture molding dies for injection molding processes.


Original Abstract Submitted

A method for manufacturing a molding die used with an injection molder, the method including plasticizing a creating material containing metal particles and resin to produce a plasticized material, and dispensing the plasticized material toward a stage to stack layers on each other to create a laminate that forms at least a portion of the molding die, with an average particle diameter D of the metal particles being smaller than or equal to 23 μm.