US Patent Application 18320668. LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING SAME simplified abstract

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LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING SAME

Organization Name

NICHIA CORPORATION

Inventor(s)

Hiroki Tominaga of Tokushima-shi (JP)

Kosuke Sato of Anan-shi (JP)

LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18320668 titled 'LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING SAME

Simplified Explanation

The patent application describes a method of manufacturing a light emitting module.

  • The method involves providing an intermediate structure that includes a wiring board with a metal layer, a first conducting member, and a second conducting member.
  • A resist layer with openings is then disposed on the intermediate structure.
  • A light emitting element with a first electrode and a second electrode is placed on the resist layer, with the electrodes facing the first and second conducting members.
  • A portion of the lower surface of the light emitting element is exposed through the openings in the resist layer.
  • A first bonding member is formed on the first conducting member, and a second bonding member is formed on the second conducting member.
  • Finally, the resist layer is removed.


Original Abstract Submitted

A method of manufacturing a light emitting module includes: providing an intermediate structure that includes a wiring board having an upper surface and including a metal layer, a first conducting member on the metal layer, and a second conducting member on the metal layer; disposing, on the intermediate structure, a resist layer having openings; providing a light emitting element including a first electrode and a second electrode, and disposing the light emitting element on the resist layer such that the first electrode and the second electrode respectively face the first conducting member and the second conducting member while a portion of an outer periphery of the lower surface of the light emitting element is exposed from the resist layer in the openings; forming a first bonding member on the first conducting member and forming a second bonding member on the second conducting member; and removing the resist layer.

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