US Patent Application 18246790. PRODUCTION METHOD FOR A MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE OR MICROPHONE DEVICE simplified abstract
Contents
PRODUCTION METHOD FOR A MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE OR MICROPHONE DEVICE
Organization Name
Inventor(s)
Heribert Weber of Nuertingen (DE)
Andreas Scheurle of Leonberg (DE)
Hans Artmann of Boeblingen-Dagersheim (DE)
Peter Schmollngruber of Aidlingen (DE)
Thomas Friedrich of Moessingen-Oeschingen (DE)
Uwe Schiller of Tuebingen (DE)
PRODUCTION METHOD FOR A MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE OR MICROPHONE DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18246790 titled 'PRODUCTION METHOD FOR A MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE OR MICROPHONE DEVICE
Simplified Explanation
The patent application describes a method for producing a small mechanical component used in sensor devices or microphones.
- The method involves creating a supporting structure made of a sacrificial material on a substrate surface. This structure includes a sacrificial material layer, etching holes, and supporting posts.
- The substrate surface is then etched to create a cavity that is supported by the structure.
- A diaphragm made of semiconductor material is formed on or over the sacrificial material layer of the supporting structure.
- A layer stack is deposited, consisting of sacrificial layers and a counter electrode.
- The diaphragm is exposed by removing the supporting structure and sacrificial layers.
Overall, this method allows for the production of a micromechanical component with a diaphragm that can be used in sensor devices or microphones.
Original Abstract Submitted
A production method for a micromechanical component for a sensor device or microphone device. The method includes: forming a supporting structure composed of a first sacrificial material on a substrate surface of a substrate with a first sacrificial material layer, a plurality of etching holes structured through the first sacrificial material layer, and a plurality of supporting posts projecting into the substrate; etching into the substrate surface at least one cavity spanned by the supporting structure; forming a diaphragm composed of at least one semiconductor material on or over the first sacrificial material layer of the supporting structure; depositing a layer stack comprising at least one sacrificial layer and at least one counter electrode; and exposing the diaphragm by at least partially removing at least the supporting structure and the at least one sacrificial layer.
