US Patent Application 18246364. ACRYLAMIDE OR (METH)ACRYLAMIDE-CONTAINING HIGH TG ADDITIVE FOR PRESSURE SENSITIVE ADHESIVES simplified abstract
Contents
ACRYLAMIDE OR (METH)ACRYLAMIDE-CONTAINING HIGH TG ADDITIVE FOR PRESSURE SENSITIVE ADHESIVES
Organization Name
3M INNOVATIVE PROPERTIES COMPANY
Inventor(s)
Sung-Tso Lin of Taoyuan City (TW)
Ching-Yi Liu of Zhunan Township (TW)
Ying-Yuh Lu of Woodbury MN (US)
Wei-Cheng Su of Taoyuan Hsien (TW)
ACRYLAMIDE OR (METH)ACRYLAMIDE-CONTAINING HIGH TG ADDITIVE FOR PRESSURE SENSITIVE ADHESIVES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18246364 titled 'ACRYLAMIDE OR (METH)ACRYLAMIDE-CONTAINING HIGH TG ADDITIVE FOR PRESSURE SENSITIVE ADHESIVES
Simplified Explanation
- The patent application describes a composition that includes a base resin and an oligomer additive. - The base resin contains between 4% and 15% acrylic acid monomer. - The oligomer additive can be either an acrylamide or meth(acrylamide) copolymer, or a high glass transition temperature monomer. - The oligomer additive has a molecular weight range of 20,000 to 1,000,000 and a glass transition temperature of 70°C to 115°C. - The composition has a blending ratio of base resin to oligomer additive of 7 to 30 parts per hundred of resin.
Original Abstract Submitted
The present application is a composition including abase resin comprising between about 4% and about 15% acrylic acid monomer and an oligomer additive comprising (a) one of an acrylamide or meth(acrylamide) copolymer and (b) a high glass transition temperature monomer. The oligomer additive has a molecular weight range of between about 20,000 and about 1,000,000 and a glass transition temperature of between about 70° C. and about 115° C. The composition has a blending ratio of base resin to oligomer additive of between about 7 to about 30 parts per hundred of resin.
