US Patent Application 18246091. FILM FORMING DEVICE, MANUFACTURING METHOD OF ELECTRODE FOIL FOR ELECTROLYTIC CAPACITOR, AND MANUFACTURING METHOD FOR ELECTROLYTIC CAPACITOR simplified abstract
FILM FORMING DEVICE, MANUFACTURING METHOD OF ELECTRODE FOIL FOR ELECTROLYTIC CAPACITOR, AND MANUFACTURING METHOD FOR ELECTROLYTIC CAPACITOR
Organization Name
Panasonic Intellectual Property Management Co., Ltd.
Inventor(s)
Mitsuhisa Yoshimura of OSAKA FU (JP)
Naomi Kurihara of OSAKA FU (JP)
Akihiro Yamaguchi of NARA KEN (JP)
FILM FORMING DEVICE, MANUFACTURING METHOD OF ELECTRODE FOIL FOR ELECTROLYTIC CAPACITOR, AND MANUFACTURING METHOD FOR ELECTROLYTIC CAPACITOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 18246091 titled 'FILM FORMING DEVICE, MANUFACTURING METHOD OF ELECTRODE FOIL FOR ELECTROLYTIC CAPACITOR, AND MANUFACTURING METHOD FOR ELECTROLYTIC CAPACITOR
Simplified Explanation
The patent application describes a film-forming device used to create a film on a metal foil using a gas phase method.
- The device includes a film-forming region where the film is formed on the metal foil.
- Downstream of the film-forming region, there are conveyors that draw the metal foil away from the film-forming region.
- A control unit is present to regulate the stress applied to the metal foil by the conveyors, ensuring it is 21 N/mm or less.
- The purpose of this device is to prevent defects from occurring on the film-forming target metal foil.
Original Abstract Submitted
A film-forming device disclosed is a film-forming device for forming a film on a metal foil having a porous portion on a main surface thereof by a gas phase method, and includes a film-forming region in which the film is formed on the metal foil, conveyors to provided downstream of the film-forming region and drawing the metal foil from the film-forming region, and a control unit that controls the stress applied to the metal foil from the conveyors to 21 N/mmor less. This provides a film-forming device which does not cause defects easily on a film-forming target metal foil.
