US Patent Application 18245980. PRINTED CIRCUIT BOARD AND METHOD FOR DESIGNING THE SAME simplified abstract
Contents
PRINTED CIRCUIT BOARD AND METHOD FOR DESIGNING THE SAME
Organization Name
3M INNOVATIVE PROPERTIES COMPANY
Inventor(s)
Adam R. Krause of Charlotte NC (US)
PRINTED CIRCUIT BOARD AND METHOD FOR DESIGNING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18245980 titled 'PRINTED CIRCUIT BOARD AND METHOD FOR DESIGNING THE SAME
Simplified Explanation
The patent application describes a computer-based method for designing a printed circuit board (PCB) with multiple conductive layers.
- The method involves determining the conductive elements in each layer and dividing them into thermal zones.
- A clearance ruleset is used to determine the minimum distance required between different conductive elements.
- The method checks for spacing violations by comparing the distance between conductive elements to the minimum clearance.
- Thermal analysis is performed on electronic components within each thermal zone to identify any thermal violations.
- The method records spacing and thermal violations for further analysis and improvement of the PCB design.
Original Abstract Submitted
A computer-implemented method for designing a printed circuit board including one or more conductive layers is disclosed. The method includes determining one or more conductive elements of each conductive layer, and determining a plurality of thermal zones. Each conductive element is included in a corresponding thermal zone. The method further includes retrieving a clearance ruleset including minimum clearances for the plurality of conductive elements; selecting one conductive element and one other conductive element; determining a distance between the one conductive element and the one other conductive element in three-dimensional space; and recording a spacing violation if the distance between the one conductive element and the one other conductive element is less than the minimum clearance for the one conductive element and the one other conductive element. The method further includes performing thermal analysis of electronic components of each thermal zone and recording a thermal violation based on the thermal analysis.
