US Patent Application 18232220. PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract

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PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.


Inventor(s)

Yen-Hao Chen of New Taipei City (TW)

Wei-Han Lai of New Taipei City (TW)

Ching-Yu Chang of Yuansun Village (TW)

PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18232220 titled 'PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Simplified Explanation

The patent application describes a manufacturing method that involves applying a photoresist layer on a substrate. The photoresist composition used in this method includes a photoactive compound, a polymer, and a crosslinker. The structure of the polymer is also discussed.

  • The patent application focuses on a manufacturing method for applying a photoresist layer on a substrate.
  • The photoresist composition used in this method includes a photoactive compound, a polymer, and a crosslinker.
  • The polymer structure is an important aspect of the invention and is described in detail.
  • The method aims to improve the manufacturing process of photoresist layers by utilizing this specific composition and polymer structure.
  • The patent application does not provide a specific title for the invention.


Original Abstract Submitted

Manufacturing method includes forming photoresist layer including photoresist composition over substrate. Photoresist composition includes: photoactive compound, polymer, crosslinker. The polymer structure

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