US Patent Application 18231416. METHOD AND APPARATUS FOR REMOVING CONTAMINATION simplified abstract
Contents
METHOD AND APPARATUS FOR REMOVING CONTAMINATION
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Yu-Chih Huang of Hsinchu City (TW)
Yu-Kai Chiou of Taipei City (TW)
Chieh-Jen Cheng of Hsinchu City (TW)
Li-Jui Chen of Hsinchu City (TW)
METHOD AND APPARATUS FOR REMOVING CONTAMINATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18231416 titled 'METHOD AND APPARATUS FOR REMOVING CONTAMINATION
Simplified Explanation
The patent application describes cleaning equipment for an EUV wafer chuck or clamp.
- The equipment is designed to remove particles that have accumulated between burls on the surface of the wafer chuck.
- It includes a spinning bi-polar electrode placed near the surface.
- The electrode generates a symmetric electric field that attracts and adsorbs charged particle residue from the surface.
- This cleaning process occurs when the wafer chuck is not in use.
Original Abstract Submitted
Cleaning equipment for an EUV wafer chuck or clamp, which removes particles that have accumulated between burls on the surface of the wafer chuck. The equipment includes a spinning bi-polar electrode placed in proximity to the surface, which can attract and adsorb the charged particle residue therefrom using its generated symmetric electric field when the wafer chuck is not in use.
