US Patent Application 18228333. Micro-Electro-Mechanical System (Mems) Thermal Sensor simplified abstract
Contents
Micro-Electro-Mechanical System (Mems) Thermal Sensor
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Shih-Chi Kuo of Yangmei City (TW)
Micro-Electro-Mechanical System (Mems) Thermal Sensor - A simplified explanation of the abstract
This abstract first appeared for US patent application 18228333 titled 'Micro-Electro-Mechanical System (Mems) Thermal Sensor
Simplified Explanation
The abstract describes a micro-electro-mechanical system (MEMS) thermal sensor and a method of fabricating it.
- The method involves forming sensing electrodes with electrode fingers on a substrate.
- A patterned layer with a rectangular cross-section is formed between a pair of the electrode fingers.
- The electrode fingers are suspended above the substrate in an interdigitated configuration.
- The patterned layer is modified to have a curved cross-section between the pair of electrode fingers.
- A curved sensing element is formed on the modified patterned layer to connect to the electrode fingers.
- The modified patterned layer is then removed.
Original Abstract Submitted
The structure of a micro-electro-mechanical system (MEMS) thermal sensor and a method of fabricating the MEMS thermal sensor are disclosed. A method of fabricating a MEMS thermal sensor includes forming first and second sensing electrodes with first and second electrode fingers, respectively, on a substrate and forming a patterned layer with a rectangular cross-section between a pair of the first electrode fingers. The first and second electrode fingers are formed in an interdigitated configuration and suspended above the substrate. The method further includes modifying the patterned layer to have a curved cross-section between the pair of the first electrode fingers, forming a curved sensing element on the modified patterned layer to couple to the pair of the first electrodes, and removing the modified patterned layer.
