US Patent Application 18228201. SHOWERHEAD ASSEMBLY AND METHOD OF SERVICING ASSEMBLY FOR SEMICONDUCTOR MANUFACTURING simplified abstract

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SHOWERHEAD ASSEMBLY AND METHOD OF SERVICING ASSEMBLY FOR SEMICONDUCTOR MANUFACTURING

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Po-Wei Wang of Hsinchu (TW)

Chao-Hsing Lai of Hsinchu (TW)

Hsiao-Feng Lu of Hsinchu (TW)

SHOWERHEAD ASSEMBLY AND METHOD OF SERVICING ASSEMBLY FOR SEMICONDUCTOR MANUFACTURING - A simplified explanation of the abstract

This abstract first appeared for US patent application 18228201 titled 'SHOWERHEAD ASSEMBLY AND METHOD OF SERVICING ASSEMBLY FOR SEMICONDUCTOR MANUFACTURING

Simplified Explanation

The patent application describes a method for automatically adjusting a showerhead in a wafer cleaning process to reduce metal oxide deposits.

  • The method involves using an adjustable distributor assembly within a showerhead to control the flow of a cleaning material.
  • The initial value of a configurable parameter of the distributor assembly is determined.
  • A monitoring device measures the amount and thickness of polymeric residues and metal oxide deposits on the wafer's cleaning surface.
  • The measurement is compared to an acceptable range to determine if it falls within acceptable limits.
  • If the measurement is outside the acceptable range, the configurable parameter of the distributor assembly is automatically adjusted.
  • The adjustment is made to bring the measurement within the acceptable range and reduce metal oxide deposits on the wafer.


Original Abstract Submitted

A method, comprising: providing an adjustable distributor assembly disposed within a showerhead configured to provide selectively adjustable openings through which a cleaning material passes; determining an initial value of a configurable parameter of an adjustable distributor assembly; performing an amount/thickness measurement of a layer including polymeric residues and metal oxide deposits at a cleaning surface of a wafer by a monitoring device; determining whether a variation in the amount/thickness measurement is within an acceptable range; and in response to the variation in the amount/thickness measurement that is not within the acceptable range, automatically adjusting the configurable parameter of the adjustable distributor assembly to set the variation in the amount/thickness measurement within the acceptable range so that the cleaning material that passes through the selectively adjustable openings of the adjustable distributor assembly reduces metal oxide deposits.

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