US Patent Application 18224794. HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENEOUS DIE INTEGRATION APPLICATIONS simplified abstract
HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENEOUS DIE INTEGRATION APPLICATIONS
Organization Name
Inventor(s)
Srinivas Pietambaram of Gilbert AZ (US)
Rahul Manepalli of Chandler AZ (US)
HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENEOUS DIE INTEGRATION APPLICATIONS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18224794 titled 'HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENEOUS DIE INTEGRATION APPLICATIONS
Simplified Explanation
- The patent application describes electronic packages and methods of forming them. - The package includes a redistribution layer (RDL) and an interposer. - A glass core is formed over the RDL and surrounds the interposer. - The package also includes multiple dies that are communicatively coupled with the interposer.
Original Abstract Submitted
Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, a microelectronic device package may include a redistribution layer (RDL) and an interposer over the RDL. In an embodiment, a glass core may be formed over the RDL and surround the interposer. In an embodiment, the microelectronic device package may further comprise a plurality of dies over the interposer. In an embodiment, the plurality of dies are communicatively coupled with the interposer.
