US Patent Application 18224691. SOLID-STATE IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS simplified abstract
Contents
SOLID-STATE IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS
Organization Name
Inventor(s)
Atsushi Masagaki of Kanagawa (JP)
Yusuke Tanaka of Kanagawa (JP)
SOLID-STATE IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18224691 titled 'SOLID-STATE IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS
Simplified Explanation
The present disclosure is about a solid-state image pickup device and an electronic apparatus that prevent leakage of charges between adjacent pixels.
- The device uses different on-chip lenses for each pixel to perform photoelectric conversion on light incident from a back surface.
- A pixel separation wall is formed between adjacent pixels, consisting of a front-side trench and a backside trench.
- A wiring layer is provided on the front surface.
- This technology is applicable to a backside illuminated CMOS image sensor.
Original Abstract Submitted
The present disclosure relates to a solid-state image pickup device and an electronic apparatus that are capable of preventing leakage of charges between adjacent pixels. A plurality of pixels perform photoelectric conversion on light incident from a back surface via different on-chip lenses for each pixel. A pixel separation wall is formed between pixels adjacent to each other, and includes a front-side trench formed from a front surface and a backside trench formed from the back surface. A wiring layer is provided on the front surface. The present disclosure is applicable to, for example, a backside illuminated CMOS image sensor.
