US Patent Application 18224504. ELECTRICAL INTERCONNECT BRIDGE simplified abstract
Contents
ELECTRICAL INTERCONNECT BRIDGE
Organization Name
Inventor(s)
Srinivas V. Pietambaram of Gilbert AZ (US)
Rahul N. Manepalli of Chandler AZ (US)
ELECTRICAL INTERCONNECT BRIDGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18224504 titled 'ELECTRICAL INTERCONNECT BRIDGE
Simplified Explanation
- The patent application is about a technology called electrical interconnect bridge. - The electrical interconnect bridge is made of a mold compound material called bridge substrate. - The bridge substrate contains multiple routing layers, each with fine line and space (FLS) traces. - The bridge also includes a via, which is a connection that goes through the substrate. - The via allows the FLS traces in one routing layer to be electrically connected to the FLS traces in another routing layer. - The purpose of this technology is to provide a means for connecting different routing layers within the bridge substrate. - The technology can be used in various electrical applications where interconnecting different layers is required.
Original Abstract Submitted
Electrical interconnect bridge technology is disclosed. An electrical interconnect bridge can include a bridge substrate formed of a mold compound material. The electrical interconnect bridge can also include a plurality of routing layers within the bridge substrate, each routing layer having a plurality of fine line and space (FLS) traces. In addition, the electrical interconnect bridge can include a via extending through the substrate and electrically coupling at least one of the FLS traces in one of the routing layers to at least one of the FLS traces in another of the routing layers.
