US Patent Application 18224434. Layout Design Methodology For Stacked Devices simplified abstract
Contents
Layout Design Methodology For Stacked Devices
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Fong-Yuan Chang of Hsinchu (TW)
Po-Hsiang Huang of Tainan City (TW)
Chin-Her Chien of Chung-Li City (TW)
Layout Design Methodology For Stacked Devices - A simplified explanation of the abstract
This abstract first appeared for US patent application 18224434 titled 'Layout Design Methodology For Stacked Devices
Simplified Explanation
The patent application describes a layout design methodology for a device with multiple identical structures.
- The device consists of stacked dies, with each die having a first, second, and third layer.
- The second die includes a through-silicon via (TSV) and a circuit, while the third die includes another TSV and circuit.
- The first and second TSVs are linearly coextensive, meaning they have the same length.
- The circuits on each die are logic circuits that generate unique identifiers for the dies using comparators and counters.
- The counters of each die are connected in series between the dice.
- All the dice are manufactured using the same masks, but each retains a unique logical identifier.
- This allows for a single path in the layout to address a specific die in the stack of dice.
Original Abstract Submitted
A layout design methodology is provided for a device that includes two or more identical structures. Each device can have a first die, a second die stacked over the first die and a third die stacked over the second die. The second die can include a first through-silicon via (TSV) and a first circuit, and the third die can include a second TSV and a second circuit. The first TSV and the second TSV can be linearly coextensive. The first and second circuit can each be a logic circuit having a comparator and counter used to generate die identifiers. The counters of respective device die can be connected in series between the dice. Each die can be manufactured using the same masks but retain unique logical identifiers. A given die in a stack of dice can thereby be addressed by a single path in a same die layout.
