US Patent Application 18223498. SYSTEM AND METHOD FOR HIGH SPEED INSPECTION OF SEMICONDUCTOR SUBSTRATES simplified abstract
Contents
SYSTEM AND METHOD FOR HIGH SPEED INSPECTION OF SEMICONDUCTOR SUBSTRATES
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Sheng He Huang of Taichung City (TW)
Chung-Pin Chou of Hsinchu City (TW)
Shiue-Ming Guo of Taichung City (TW)
Hsuan-Chia Kao of Taichung City (TW)
Yan-Cheng Chen of Taichung City (TW)
Sheng-Ching Kao of Hsinchu (TW)
SYSTEM AND METHOD FOR HIGH SPEED INSPECTION OF SEMICONDUCTOR SUBSTRATES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18223498 titled 'SYSTEM AND METHOD FOR HIGH SPEED INSPECTION OF SEMICONDUCTOR SUBSTRATES
Simplified Explanation
This patent application describes a method for inspecting a semiconductor substrate using light beams.
- A first beam of light is split into multiple second beams of light.
- The second beams of light are transmitted onto a first set of locations on top of the semiconductor substrate.
- The reflected beams of light from the first set of locations are received.
- The received reflected beams of light are detected to generate signals.
- The signals are analyzed to determine if there are any defects at the first set of locations.
Original Abstract Submitted
In a method of inspection of a semiconductor substrate a first beam of light is split into two or more second beams of light. The two or more second beams of light are respectively transmitted onto a first set of two or more first locations on top of the semiconductor substrate. In response to the transmitted two or more second beams of light, two or more reflected beams of light from the first set of two or more first locations are received. The received two or more reflected beams of light are detected to generate two or more detected signals. The two or more detected signals are analyzed to determine whether a defect exists at the set of the two or more first locations.
