US Patent Application 18222372. POLY(AMIDE-IMIDE) COPOLYMER, METHOD OF MANUFACTURING THE SAME, POLY(AMIDE-IMIDE) COPOLYMER FILM, WINDOW FOR DISPLAY DEVICE, AND DISPLAY DEVICE simplified abstract

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POLY(AMIDE-IMIDE) COPOLYMER, METHOD OF MANUFACTURING THE SAME, POLY(AMIDE-IMIDE) COPOLYMER FILM, WINDOW FOR DISPLAY DEVICE, AND DISPLAY DEVICE

Organization Name

Samsung Electronics Co., Ltd.


Inventor(s)

Hyunjeong Jeon of Seoul (KR)

Sang Soo Jee of Hwaseong-si (KR)

Kyeong-sik Ju of Suwon-si (KR)

POLY(AMIDE-IMIDE) COPOLYMER, METHOD OF MANUFACTURING THE SAME, POLY(AMIDE-IMIDE) COPOLYMER FILM, WINDOW FOR DISPLAY DEVICE, AND DISPLAY DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18222372 titled 'POLY(AMIDE-IMIDE) COPOLYMER, METHOD OF MANUFACTURING THE SAME, POLY(AMIDE-IMIDE) COPOLYMER FILM, WINDOW FOR DISPLAY DEVICE, AND DISPLAY DEVICE

Simplified Explanation

The patent application describes a copolymer made of poly(amide-imide) that contains both amide and imide structural units.

  • The copolymer has an amide bond in its polymer main chain and an imide bond in its polymer main chain.
  • At least one imide structural unit in the copolymer is cross-linked to an adjacent polymer main chain through an amide bond.
  • The invention provides a new type of copolymer with unique properties and potential applications.


Original Abstract Submitted

A poly(amide-imide) copolymer including an amide structural unit having an amide bond in a polymer main chain and an imide structural unit having an imide bond in a polymer main chain, wherein at least one imide structural unit includes a moiety cross-linked to an adjacent polymer main chain through an amide bond.