US Patent Application 18216445. SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18216445 Titled 'SEMICONDUCTOR PACKAGE'
Simplified Explanation
This abstract describes a semiconductor package that consists of a stack of semiconductor chips placed vertically on a substrate. The chips are connected to the substrate through pillars. The lowermost chip has an adhesive layer on its bottom surface, which is protected by a first lower protective layer and a second lower protective layer. The entire chip stack is then covered by a mold layer that fills the space between the pillars. The second lower protective layer is thicker than the adhesive layer in the vertical direction.
Original Abstract Submitted
A semiconductor package includes a chip stack comprising semiconductor chips vertically stacked on a substrate in a first direction perpendicular to a top surface of the substrate, pillars between the substrate and the chip stack, an adhesive layer on a bottom surface of a lowermost semiconductor chip of the semiconductor chips, a first lower protective layer between the adhesive layer and the pillars, a second lower protective layer between the first lower protective layer and the adhesive layer, and a mold layer covering the chip stack and filling a space between the pillars. A thickness of the second lower protective layer in the first direction is greater than a thickness of the adhesive layer in the first direction.
