US Patent Application 18215711. SURFACE MOUNT DEVICE BONDED TO AN INNER LAYER OF A MULTI-LAYER SUBSTRATE simplified abstract
Contents
SURFACE MOUNT DEVICE BONDED TO AN INNER LAYER OF A MULTI-LAYER SUBSTRATE
Organization Name
Inventor(s)
Kelvin Tan Aik Boo of George Town (MY)
Chin Hui Chong of Braddell Hill (SG)
Seng Kim Ye of Fernvale Close (SG)
Hem P. Takiar of Fremont CA (US)
SURFACE MOUNT DEVICE BONDED TO AN INNER LAYER OF A MULTI-LAYER SUBSTRATE - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18215711 Titled 'SURFACE MOUNT DEVICE BONDED TO AN INNER LAYER OF A MULTI-LAYER SUBSTRATE'
Simplified Explanation
The abstract describes an apparatus that consists of multiple layers of a substrate. The primary layer is the outermost layer, followed by a secondary layer with a hole that goes through it to the inner layer. The inner layer is sandwiched between the primary and secondary layers and contains bond pads for components. These bond pads are exposed through the hole in the secondary layer.
Original Abstract Submitted
An apparatus includes a primary layer of a substrate. The apparatus includes a secondary layer of the substrate having a first open area that extends through the secondary layer to an inner layer of the substrate. The apparatus includes the inner layer of the substrate that is positioned between the primary layer and the secondary layer. The inner layer includes first component bond pads that are disposed on the inner layer and that are exposed via the first open area of the secondary layer.
