US Patent Application 18211204. ATTACHMENT SYSTEM FOR AN ELECTRONIC DEVICE simplified abstract
Contents
ATTACHMENT SYSTEM FOR AN ELECTRONIC DEVICE
Organization Name
Inventor(s)
Ryan C. Perkins of Cupertino CA (US)
Phillip M. Hobson of Cupertino CA (US)
Michael J. Webb of Scotts Valley CA (US)
ATTACHMENT SYSTEM FOR AN ELECTRONIC DEVICE - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18211204 Titled 'ATTACHMENT SYSTEM FOR AN ELECTRONIC DEVICE'
Simplified Explanation
The abstract describes a removable module and housing for an attachment system of a consumer product. The module includes a locking mechanism with two parts that are connected together. The locking mechanism also includes two spring mechanisms. One spring causes the top surface of the first part to be flush with the module, while the other spring causes the bottom surface of the second part to stick out from the module.
Original Abstract Submitted
A removable module and a housing for an attachment system of a consumer product is described. The removable module includes a locking mechanism comprising a first portion having a substantially planar top surface and second portion that comprises a substantially non-planar bottom surface. The first portion and the second portion are coupled together. The locking mechanism also includes a first spring mechanism coupled between the first portion and the second portion. The first spring mechanism causes the first portion to be biased away from the second portion. The locking mechanism also includes a second spring mechanism. The second spring mechanism causes the substantially planar top surface of the first portion to be biased substantially flush with respect to the removable module and also causes the substantially non-planar bottom surface of the second portion to be biased proud with respect to the removable module.
