US Patent Application 18209191. ELECTRONIC DEVICE COVER HAVING LAYERED STRUCTURE AND METHOD FOR MANUFACTURING SAME simplified abstract
Contents
ELECTRONIC DEVICE COVER HAVING LAYERED STRUCTURE AND METHOD FOR MANUFACTURING SAME
Inventors
ELECTRONIC DEVICE COVER HAVING LAYERED STRUCTURE AND METHOD FOR MANUFACTURING SAME - A simplified explanation of the abstract
- This abstract for appeared for patent application number 18209191 Titled 'ELECTRONIC DEVICE COVER HAVING LAYERED STRUCTURE AND METHOD FOR MANUFACTURING SAME'
Simplified Explanation
This application describes a cover for an electronic device that is made up of multiple layers. The cover includes a substrate made of magnesium, which is a type of metal. On top of the substrate, there is a first layer that has undergone a chemical treatment to enhance its properties. This layer is followed by a bending supplement layer, which helps to improve the flexibility of the cover. On top of that, there is a color layer, which adds aesthetic appeal to the cover. Finally, there is an ultraviolet molding layer, which provides additional protection and durability. The application also mentions that there can be other variations of this design.
Original Abstract Submitted
This application relates to an electronic device cover having a layered structure and a method for manufacturing the same. An embodiment may include a substrate including magnesium, a first chemical conversion-treated layer formed on the substrate, a bending supplement layer formed on the first chemical conversion-treated layer, a color layer formed on the bending supplement layer, and an ultraviolet molding layer formed on the color layer. Various other embodiments are possible.
