US Patent Application 18205312. DISPLAY MODULE INCLUDING MICRO LIGHT EMITTING DIODES simplified abstract

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DISPLAY MODULE INCLUDING MICRO LIGHT EMITTING DIODES

Organization Name

SAMSUNG ELECTRONICS CO., LTD.==Inventor(s)==

[[Category:Yoonsuk Lee of Suwon-si (KR)]]

[[Category:Eunhye Kim of Suwon-si (KR)]]

[[Category:Sangmoo Park of Suwon-si (KR)]]

[[Category:Jamyeong Koo of Suwon-si (KR)]]

[[Category:Sera Kwon of Suwon-si (KR)]]

[[Category:Byunghoon Lee of Suwon-si (KR)]]

[[Category:Changkyu Chung of Suwon-si (KR)]]

DISPLAY MODULE INCLUDING MICRO LIGHT EMITTING DIODES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18205312 titled 'DISPLAY MODULE INCLUDING MICRO LIGHT EMITTING DIODES

Simplified Explanation

The patent application describes a display assembly that includes multiple light emitting diodes (LEDs) and electrodes on the LEDs. These LEDs are fixed to a substrate using an adhesive layer. The adhesive layer consists of a non-conductive polymer resin, a flux agent mixed with the resin, and conductive particles dispersed in the resin. These conductive particles connect the electrodes of the LEDs to electrode pads on the substrate.

  • The display assembly includes multiple LEDs and electrodes on the LEDs.
  • The LEDs are fixed to a substrate using an adhesive layer.
  • The adhesive layer consists of a non-conductive polymer resin, a flux agent, and conductive particles.
  • The conductive particles connect the electrodes of the LEDs to electrode pads on the substrate.


Original Abstract Submitted

Provided is a display assembly including a plurality of light emitting diodes, a plurality of electrodes provided on the plurality of light emitting diodes, a substrate, a plurality of electrode pads provided on the substrate, the plurality of electrode pads being connected to the electrodes provided on the plurality of light emitting diodes, and an adhesive layer fixing the plurality of light emitting diodes to the substrate, wherein the adhesive layer includes a non-conductive polymer resin, a flux agent mixed with the non-conductive polymer resin, and a plurality of conductive particles dispersed in the non-conductive polymer resin and connecting the electrodes of the light emitting diodes and the plurality of electrode pads.