US Patent Application 18197672. HEADPHONES WITH INCREASED BACK VOLUME simplified abstract

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HEADPHONES WITH INCREASED BACK VOLUME

Inventors

Edward Siahaan of San Francisco CA (US)


Daniel R. Bloom of Alameda CA (US)


Jason J. Leblanc of Castro Valley CA (US)


Phillip Qian of Tokyo (JP)


HEADPHONES WITH INCREASED BACK VOLUME - A simplified explanation of the abstract

  • This abstract for appeared for patent application number 18197672 Titled 'HEADPHONES WITH INCREASED BACK VOLUME'

Simplified Explanation

This abstract discusses different features that can be used in headphone designs. It mentions earpad assemblies that improve sound isolation, as well as user convenience features like automatically detecting the orientation of the headphones on a user's head. The abstract also mentions power-saving features, design features, sensor configurations, and user comfort features.


Original Abstract Submitted

This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.