US Patent Application 18188929. PRE-TREATMENT APPARATUS simplified abstract
Contents
PRE-TREATMENT APPARATUS
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chun-Hsiang Wang of Tainan City (TW)
Kai Yuan Chan of Tainan City (TW)
Po-Chung Cheng of Chiayi County (TW)
Chien Chou Ko of Tainan County (TW)
PRE-TREATMENT APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18188929 titled 'PRE-TREATMENT APPARATUS
Simplified Explanation
- The patent application describes a pre-treatment apparatus that can be added to a wafer track system. - The purpose of the pre-treatment is to reduce friction at the edges of a substrate. - This reduction in edge friction helps prevent the formation of back side edge particles during subsequent processing operations. - The pre-treatment apparatus can deliver one or more gases to treat the top and/or bottom surfaces of the substrate. - It can also treat the back side edges of the substrate to further reduce edge friction and prevent overlay defects.
Original Abstract Submitted
A pre-treatment apparatus can be added as a module of a wafer track system, where the pre-treatment is designed to reduce friction at the edges of a substrate. Reducing edge friction can help prevent back side edge particles during attachment to a vacuum chuck in a subsequent processing operation that can occur, for example, in an exposure device. The pre-treatment apparatus can be configured to deliver one or more gases to treat top and/or bottom surfaces of a substrate. The pre-treatment apparatus can treat back side edges of a substrate to reduce edge friction of the substrate and to prevent overlay defects.
