US Patent Application 18167717. SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MOLDING PRESS MACHINE simplified abstract
Contents
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MOLDING PRESS MACHINE
Organization Name
Mitsubishi Electric Corporation
Inventor(s)
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MOLDING PRESS MACHINE - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18167717 Titled 'SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MOLDING PRESS MACHINE'
Simplified Explanation
The abstract describes a structural body that is partially enclosed by a positioning plate. Within this body, there is a semiconductor element, a joining member, and a base plate. These components are exposed from the positioning plate, ensuring that their positional relationship is maintained.
To achieve this, a heater heats the joining member. Simultaneously, a piston applies isotropic pressure to the semiconductor element, joining member, and base plate. This pressure is exerted through a medium and a bag member.
In simpler terms, this abstract is discussing a method of maintaining the position of various components within a structural body. By heating a joining member and applying pressure through a piston, the components are held in place.
Original Abstract Submitted
A structural body is partially surrounded by a positioning plate, and a semiconductor element, a joining member, and a base plate around the joining member are exposed from the positioning plate, so that a positional relationship between the semiconductor element and the base plate is maintained. The joining member is heated by a heater while the semiconductor element, joining member, and base plate exposed from the positioning plate are isotropically pressurized by a piston via a medium and a bag member.
