US Patent Application 18166181. SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Choongbin Yim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18166181 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The patent application describes a semiconductor package with a support wiring structure, a semiconductor chip, a cover wiring structure, and a filling member.
- The cover wiring structure has a cavity where the upper portion of the semiconductor chip is positioned.
- The cover wiring structure also has two slots, one on each side surface, which communicate with the cavity.
- The slots have different widths and extend in a direction orthogonal to the cover wiring structure.
- The filling member fills the space between the support wiring structure and the cover wiring structure.
Original Abstract Submitted
Provided is a semiconductor package including a support wiring structure, a semiconductor chip on the support wiring structure, a cover wiring structure on the semiconductor chip, and a filling member filling between the support wiring structure and the cover wiring structure, wherein the cover wiring structure includes a cavity which extends from a lower surface of the cover wiring structure into the cover wiring structure and in which an upper portion of the semiconductor chip is positioned, and a first slot and a second slot respectively having a first width and a second width in a first horizontal direction, the first slot and the second slot communicating with the cavity, and respectively extending to a first side surface and a second side surface of the cover wiring structure, which are opposite to each other in a second horizontal direction which is orthogonal to the first horizontal direction of the cover wiring structure.
