US Patent Application 18164851. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
Yun Seok Choi of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18164851 Titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME'
Simplified Explanation
The abstract describes a semiconductor package that consists of multiple layers and components. It includes a wiring structure with insulating layers and wiring pads, a semiconductor chip, and an interposer. The interposer also has insulating layers and wiring pads. The package has a connecting structure made of metal layers that connect the wiring pads. There is also a mold layer between the wiring structure and the interposer.
Original Abstract Submitted
A semiconductor package includes a wiring structure including a first insulating layer and a first wiring pad. The first wiring pad is in the first insulating layer. The package includes a semiconductor chip on the wiring structure, and an interposer on the semiconductor chip. The interposer includes a second insulating layer and a second wiring pad, and the second wiring pad is in the second insulating layer. The package includes a first connecting structure including a first metal layer and a second metal layer surrounding the first metal layer. The first metal layer includes a lower metal layer adjacent to the wiring structure and an upper metal layer adjacent to the interposer, and the first connecting structure connects the first wiring pad and the second wiring pad. The package includes a mold layer between the wiring structure and the interposer.
