US Patent Application 18145949. CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME simplified abstract
Contents
CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME
Organization Name
TOYOTA JIDOSHA KABUSHIKI KAISHA
Inventor(s)
YOSHITAKA Kato of Nisshin-shi (JP)
TAKESHI Endo of Nisshin-shi (JP)
KAZUHIRO Tsuruta of Nisshin-shi (JP)
CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18145949 Titled 'CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME'
Simplified Explanation
The abstract describes a circuit module that consists of two circuit components. The first component has electrode pads on one side, and the second component has electrode pads on the other side. These electrode pads are connected using a conductive bonding material. Additionally, a first reinforcing bonding material is used to join the first surface of the first component to the second surface of the second component. A second reinforcing bonding material is also present, which is in contact with the first reinforcing bonding material and joins the two surfaces together.
Original Abstract Submitted
A circuit module includes: a first circuit component having electrode pads on a first surface; and a second circuit component having electrode pads on a second surface. A conductive bonding material joins the electrode pads of the first circuit component to the electrode pads of the second circuit component respectively. A first reinforcing bonding material is not in contact with the conductive bonding material and joins the first surface of the first circuit component to the second surface of the second circuit component. A second reinforcing bonding material is located in contact with the first reinforcing bonding material, and joins the first surface of the first circuit component to the second surface of the second circuit component.
