US Patent Application 18145568. DISPLAY PANEL AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
Organization Name
Inventor(s)
Haijiang Yuan of Shenzhen (CN)
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18145568 titled 'DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The patent application describes a display panel with a drive backplane and multiple light-emitting chips arranged on it.
- The light-emitting chips consist of different semiconductor layers and an undoped semiconductor layer.
- The undoped semiconductor layer has a conductive via.
- A part of the conductive pattern portion is located in the conductive via and is in contact with the N-type semiconductor layer.
- Another part of the conductive pattern portion extends from the conductive via and connects to the drive backplane.
Original Abstract Submitted
A display panel includes a drive backplane and a plurality of light-emitting chips arranged on the drive backplane. Each of the light-emitting chips includes an N-type semiconductor layer, a multi-quantum well layer and a P-type semiconductor layer arranged on the undoped semiconductor layer in sequence and an undoped semiconductor layer. The undoped semiconductor layer is provided with a conductive via. The light-emitting chip further includes a conductive pattern portion, a part of the conductive pattern portion is located in the conductive via and is in contact with the N-type semiconductor layer, and another part of the conductive pattern portion protrudes from the conductive via and is connected to the drive backplane.
