US Patent Application 18140356. SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Byung Ju Kang of Suwon-si (KR)
Kwan Young Chun of Suwon-si (KR)
Chul Hong Park of Suwon-si (KR)
Suhyeong Choi of Suwon-si (KR)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18140356 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The patent application describes a semiconductor device with specific features. Here is a simplified explanation of the abstract:
- The semiconductor device has a substrate with two sides, a first side, and a second side.
- On the first side of the substrate, there are two power rails, the first power rail, and the second power rail. These power rails extend in one direction and are separated in another direction.
- Also on the first side of the substrate, there are two active regions, the first active region, and the second active region. These active regions are defined by a film that separates the power rails and are separated in the second direction.
- On the second side of the substrate, there is a power delivery network.
- The device includes a power through via that penetrates the film and the substrate, connecting the power delivery network and the first power rail.
Bullet points explaining the patent/innovation:
- The semiconductor device has separate power rails and active regions, allowing for efficient power distribution and isolation of different components.
- The power through via provides a direct connection between the power delivery network and the first power rail, ensuring reliable power supply to the device.
- The use of the element separation film helps in defining and separating the active regions, preventing interference between different components.
- The arrangement of power rails and active regions on different sides of the substrate allows for compact and efficient integration of components in the semiconductor device.
- Overall, this innovation improves the performance and reliability of the semiconductor device by optimizing power distribution and component isolation.
Original Abstract Submitted
A semiconductor device includes a substrate including a first side and a second side opposite to the first side, a first power rail and a second power rail provided on the first side of the substrate, the first power rail and the second power rail extending in a first direction and being separated in a second direction, a first active region and a second active region provided on the first side of the substrate, the first active region and the second active region being defined by an element separation film between the first power rail and the second power rail and being separated in the second direction, a power delivery network provided on the second side of the substrate, and a first power through via penetrating the element separation film and the substrate, the first power through via connecting the power delivery network and the first power rail.
