US Patent Application 18125868. MULTILAYER ELECTRONIC COMPONENT simplified abstract
Contents
MULTILAYER ELECTRONIC COMPONENT
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18125868 titled 'MULTILAYER ELECTRONIC COMPONENT
Simplified Explanation
The patent application describes a multilayer electronic component with a dielectric layer and internal electrodes.
- The component has a body with alternating layers of dielectric material and internal electrodes.
- The body has different surfaces that face different directions.
- The component also has external electrodes with plating layers and electrode layers.
- The external electrodes are connected to the internal electrodes.
- The electrode layers do not contain glass.
Original Abstract Submitted
A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and having first and second surfaces opposing in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing in a third direction, first and second external electrodes including first and second plating layers disposed on the third and fourth surfaces, respectively and first and second electrode layers disposed on the first and second plating layers, respectively, first and second band electrodes disposed on the first surface and connected to the first and second external electrode, respectively. The first and second electrode layers do not contain glass.
