US Patent Application 18120866. SEMICONDUCTOR PACKAGE simplified abstract

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SEMICONDUCTOR PACKAGE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.==Inventor(s)==

[[Category:Junyoung Ko of Suwon-si (KR)]]

SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18120866 titled 'SEMICONDUCTOR PACKAGE

Simplified Explanation

The patent application describes a semiconductor package design.

  • The package includes a substrate with two surfaces, a redistribution layer on one surface, and a dielectric layer between the substrate and the redistribution layer.
  • A semiconductor chip is placed between the substrate and the redistribution layer and is electrically connected to the redistribution layer.
  • A connection structure is present between the substrate and the redistribution layer, which is also electrically connected to both surfaces.
  • The dielectric layer covers the semiconductor chip and the connection structure and extends between the semiconductor chip and the substrate surface.


Original Abstract Submitted

A semiconductor package is provided. The semiconductor package includes a substrate including first and second surfaces opposite to each other, a redistribution layer on the first surface and having third and fourth surfaces opposite to each other wherein the third surface of the redistribution layer faces the first surface, a semiconductor chip between the substrate and the redistribution layer, the semiconductor chip spaced apart from the first surface and electrically connected to the third surface, a connection structure between the substrate and the redistribution layer and horizontally spaced apart from the semiconductor chip wherein the connection structure is electrically connected to the first surface and the third surface, and a dielectric layer between the substrate and the redistribution layer. The dielectric layer covers the semiconductor chip and the connection structure and extends between the semiconductor chip and the first surface.

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