US Patent Application 18118697. SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Kazuhiro Inoue of Kitakyushu Fukuoka (JP)
Mami Fujihara of Nakatsu Oita (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18118697 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The patent application describes a semiconductor device that includes various components such as a substrate, a light-receiving element, a switching element, and a light-emitting element.
- The device has a substrate with metal pads on the front-side.
- The light-receiving element has bonding pads on its front-surface and is connected to the metal pads on the substrate.
- The switching element has front-side and backside electrodes, as well as a control pad.
- The backside electrode of the switching element is connected to a metal pad on the substrate.
- A first conductive member connects the front-side electrode of the switching element to the bonding pad of the light-receiving element.
- A second conductive member connects the control pad of the switching element to another bonding pad of the light-receiving element.
Original Abstract Submitted
A semiconductor device includes a substrate, a light-receiving element, a switching element, a light-emitting element on the switching element, first and second conductive members. The substrate includes first to third metal pads on a front-side thereof. The light-receiving element includes first and second bonding pads on a front-surface thereof. A back-surface of the light-receiving element is connected to the first and second metal pads. The first and second bonding pads each overlap one of the first and second metal pads. The switching element includes front-side and backside electrodes and a control pad. The backside electrode is connected to the third metal pad. The first conductive member is connected to the front-side electrode of the switching element and the first bonding pad of the light-receiving element. The second conductive member is connected to the control pad of the switching element and the second bonding pad of the light-receiving element.
