US Patent Application 18115545. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Youngjun Yoon of Suwon-si (KR)
Mijeong Jeong of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18115545 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Simplified Explanation
The patent application describes a semiconductor package with a redistribution structure that includes a redistribution layer.
- The redistribution structure has a first surface and a second surface.
- A semiconductor chip is placed on the first surface and is electrically connected to the redistribution layer.
- An encapsulant is applied on top of the semiconductor chip.
- At least one antenna pattern is formed on the encapsulant.
- A side wiring line extends along the surface of the encapsulant, connecting one end of the antenna pattern to the redistribution layer.
- Electronic devices are located on the second surface of the redistribution structure and are also connected to the redistribution layer.
- The semiconductor chip and the antenna pattern are designed to transmit and receive signals through the electronic devices.
Original Abstract Submitted
Provided is a semiconductor package including a redistribution structure including first surface and a second surface opposite to each other, the redistribution structure including a redistribution layer, a semiconductor chip on the first surface of the redistribution structure, the semiconductor chip being electrically connected to the redistribution layer, an encapsulant on the semiconductor chip, at least one antenna pattern on the encapsulant, a side wiring line extending along a surface of the encapsulant from one end of the antenna pattern to the redistribution layer, and electronic devices on the second surface of the redistribution structure, the electronic devices being electrically connected to the redistribution layer, wherein the semiconductor chip and the antenna pattern are configured to transmit and receive a signal to and from each other through the electronic devices.
