US Patent Application 18100937. POLISHING PAD AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME simplified abstract

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POLISHING PAD AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.==Inventor(s)==

[[Category:Donghoon Kwon of Suwon-si (KR)]]

[[Category:Boun Yoon of Suwon-si (KR)]]

[[Category:Kihoon Jang of Suwon-si (KR)]]

POLISHING PAD AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18100937 titled 'POLISHING PAD AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME

Simplified Explanation

The patent application describes a substrate processing apparatus used for polishing substrates.

  • The apparatus includes a polishing platen with a fluid channel.
  • A polishing pad is provided on the first surface of the polishing platen.
  • The polishing pad has a pad body with a trench.
  • A thermal conductive body is placed in the trench and connected to the first surface of the polishing platen.
  • A polishing head is positioned on the polishing pad and used to support a substrate during polishing.


Original Abstract Submitted

A substrate processing apparatus includes a polishing platen including a fluid channel, a polishing pad provided on a first surface of the polishing platen, the polishing pad including a pad body including a trench and a thermal conductive body provided in the trench of the pad body and connected to the first surface of the polishing platen, and a polishing head provided on the polishing pad and configured to support a substrate.

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