US Patent Application 18096231. SLURRY COMPOSITION FOR POLISHING METAL AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME simplified abstract
SLURRY COMPOSITION FOR POLISHING METAL AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME
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SLURRY COMPOSITION FOR POLISHING METAL AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18096231 Titled 'SLURRY COMPOSITION FOR POLISHING METAL AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME'
Simplified Explanation
The abstract describes a slurry composition used for polishing metal in the manufacturing of integrated circuit devices. The composition includes various components such as a cationic polymer salt, an organic acid, an oxidizer, a pH adjuster, a small amount of inorganic abrasive, and water. The purpose of this slurry is to enhance the polishing process and achieve a desired surface finish on the metal.
Original Abstract Submitted
A slurry composition for polishing metal and a method of manufacturing an integrated circuit device, the slurry composition includes a first organic polishing booster including a cationic polymer salt that includes a quaternary ammonium cation; a second organic polishing booster including an organic acid; an oxidizer; a pH adjuster; 0 wt% to about 0.1 wt% of an inorganic abrasive; and water.
