US Patent Application 18092241. CHIP-ON-FILM SEMICONDUCTOR PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME simplified abstract
Contents
CHIP-ON-FILM SEMICONDUCTOR PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
Inventors
Seunghyun Cho of Suwon-si (KR)
CHIP-ON-FILM SEMICONDUCTOR PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME - A simplified explanation of the abstract
- This abstract for appeared for patent application number 18092241 Titled 'CHIP-ON-FILM SEMICONDUCTOR PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME'
Simplified Explanation
The abstract describes a semiconductor package called chip-on-film (COF) that consists of a main film substrate with two or more module attachment regions. Two or more sub-modules are attached to these attachment regions, each consisting of a sub-film substrate and a semiconductor chip mounted on it. Connection conductive layers are provided between the main film substrate and the sub-film substrate to electrically connect them.
Original Abstract Submitted
A chip-on-film (COF) semiconductor package includes: a main film substrate having at least two module attachment regions spaced apart from each other; at least two sub-modules respectively attached to the at least two module attachment regions and spaced apart from each other on the main film substrate, wherein each of the at least two sub-modules comprise a sub-film substrate and a semiconductor chip mounted on the sub-film substrate; and at least two connection conductive layers provided between the main film substrate and the sub-film substrate, which is included in each of the at least two sub-modules, and electrically connecting the main film substrate to the at least two sub-modules.
