US Patent Application 18077204. DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME simplified abstract

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DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME

Organization Name

HKC CORPORATION LIMITED

Inventor(s)

ZEYAO Li of Chongqing (CN)

Haijiang Yuan of Chongqing (CN)

DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18077204 titled 'DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME

Simplified Explanation

The patent application describes a method of manufacturing a display panel.

  • The display panel includes a display substrate with a first surface, a second surface, and a side surface.
  • An array circuit layer is arranged on the first surface of the display substrate.
  • A connecting substrate is provided, which has a binding circuit layer and a connecting circuit layer.
  • The connecting substrate is fixed to the side of the display substrate.
  • The connecting circuit layer is electrically connected to the array circuit layer, and the array circuit layer is electrically connected to the binding circuit layer through the connecting circuit layer.
  • A control unit is bound on the binding circuit layer.


Original Abstract Submitted

A method of manufacturing a display panel includes following operations. A display substrate is provided. The display substrate includes a first surface, a second surface opposite to the first surface, and a side surface connected to the first surface and the second surface. An array circuit layer is arranged on the first surface of the display substrate. A connecting substrate is provided. A binding circuit layer and a connecting circuit layer connected to the binding circuit layer are formed on a surface of the connecting substrate. The connecting substrate having the binding circuit layer and the connecting circuit layer is fixed to a side of the display substrate. The connecting circuit layer may be electrically connected to the array circuit layer, and the array circuit layer is electrically connected to the binding circuit layer through the connecting circuit layer. A control unit is bound on the binding circuit layer.

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