US Patent Application 18073956. CIRCUIT BOARD simplified abstract
Contents
CIRCUIT BOARD
Organization Name
Inventor(s)
Jae Hoon Ko of Gyeonggi-do (KR)
Jeffrey E. Kwak of Gyeonggi-do (KR)
In Myung Song of Gyeonggi-do (KR)
Chong Geun Ahn of Gyeonggi-do (KR)
CIRCUIT BOARD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18073956 titled 'CIRCUIT BOARD
Simplified Explanation
- The patent application is for an electronic circuit board design. - The circuit board includes multiple conductor layers stacked on top of each other. - The first conductor layer has a pad for transmitting and receiving signals to and from an external device. - The third conductor layer is stacked on top of the other layers and also transmits and receives signals to and from the external device. - One of the second conductor layers has a mesh structure and is electrically grounded. - The remaining second conductor layers have voids and are electrically opened. - The design aims to simplify the circuit board and improve signal transmission and reception.
Original Abstract Submitted
The present disclosure relates to an electronic circuit. A circuit board according to the present disclosure includes a first conductor layer including a first pad for transmitting and receiving a first signal to and from an external device, a plurality of second conductor layers stacked on the first conductor layer, and a third conductor layer stacked on the plurality of second conductor layers for transmitting and receiving a second signal to and from the external device, wherein at least one target conductor layer among the plurality of second conductor layers has a mesh structure and is electrically grounded, and remaining second conductor layers except for the at least one target conductor layer include respective voids and are electrically opened.
