US Patent Application 18033429. MICROCUT PATTERNED TRANSFER ARTICLES simplified abstract

MICROCUT PATTERNED TRANSFER ARTICLES

Organization Name

3M INNOVATIVE PROPERTIES COMPANY

Inventor(s)

Raymond P. Johnston of Lake Elmo MN (US)

Kevin W. Gotrik of Hudson WI (US)

Graham M. Clarke of Woodbury MN (US)

John J. Sullivan of Hudson WI (US)

Matthew C. Messina of Maplewood MN (US)

Scott J. Jones of Woodbury MN (US)

MICROCUT PATTERNED TRANSFER ARTICLES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18033429 titled 'MICROCUT PATTERNED TRANSFER ARTICLES

Simplified Explanation

The patent application describes a transfer article that consists of multiple layers, including a carrier layer, a release layer, and a functional layer.

• The carrier layer can be easily released from the release layer with a specific amount of force.
• The release layer contains either a metal layer or a doped semiconductor layer.
• The functional layer is placed on top of the carrier layer and includes at least one microcut inorganic layer.
• The microcut inorganic layer has a pattern of cut toolmarks and plates, with each plate having a thickness ranging from 3 nanometers to 2000 nanometers.
• The overall thickness of the transfer article is less than 3 micrometers.

Original Abstract Submitted

A transfer article includes a carrier layer releasable at a release value of from 2 to 50 grams/inch from a release layer including a metal layer or a doped semiconductor layer. A functional layer overlies the carrier layer, and the functional layer includes at least one microcut inorganic layer. The microcut inorganic layer includes a pattern of cut toolmarks and plates bounded by the toolmarks, wherein each of the plates has a thickness of about 3 nanometers to about 2000 nanometers. The transfer article has a thickness of less than 3 micrometers.