US Patent Application 18029932. DISTRIBUTED RADIOHEAD SYSTEM simplified abstract
Contents
DISTRIBUTED RADIOHEAD SYSTEM
Organization Name
Inventor(s)
Jayprakash Thakur of Bangalore (IN)
Ehud Reshef of Qiryat Tivon (IL)
Seong-Youp J. Suh of Portland OR (US)
Tal Shoshana of Ein Ayala (IL)
Ashoke Ravi of Portland OR (US)
Jose Rodrigo Camacho Perez of Guadalajara (MX)
Timo Sakari Huusari of Hillsboro OR (US)
Eli Borokhovich of Modiin-Maccabim-Reut (IL)
Ofer Benjamin of Petach-Tikva (IL)
Tae Young Yang of Portland OR (US)
Harry Skinner of Beaverton OR (US)
Kwan ho Lee of San Jose CA (US)
Jaejin Lee of Beaverton OR (US)
Dong-Ho Han of Beaverton OR (US)
Shahar Gross of Nes Ziona (IL)
Telesphor Kamgaing of Chandler AZ (US)
DISTRIBUTED RADIOHEAD SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18029932 titled 'DISTRIBUTED RADIOHEAD SYSTEM
Simplified Explanation
- The patent application describes a radio frequency circuit that includes a substrate with a radio frequency front-end to antenna connector. - The RF FE-to-Ant connector consists of a conductor track structure and a substrate connection structure. - The substrate also contains integrated radio frequency front-end circuitry. - The substrate connection structure can be solderable, weldable, or adherable. - It forms a radio frequency signal interface with an antenna circuit connection structure of an external substrate. - The substrate has an edge region where the substrate connection structure is located.
Original Abstract Submitted
In various aspects, a radio frequency circuit is provided. The radio frequency circuit may include a substrate that may include a radio frequency front-end to antenna (RF FE-to-Ant) connector. The RF FE-to-Ant connector may include a conductor track structure and a substrate connection structure coupled to the conductor track structure. The substrate may include radio frequency front-end circuitry monolithically integrated in the substrate. The substrate connection structure may include at least one of a solderable structure, a weldable structure, or an adherable structure. The substrate connection structure may be configured to form at least one radio frequency signal interface with an antenna circuit connection structure of a substrate-external antenna circuit. The substrate may include an edge region. The substrate connection structure may be disposed in the edge region.
