US Patent Application 18028606. METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGE, SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGE MANUFACTURED THEREBY, AND DISPLAY DEVICE COMPRISING SAME simplified abstract
Contents
- 1 METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGE, SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGE MANUFACTURED THEREBY, AND DISPLAY DEVICE COMPRISING SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGE, SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGE MANUFACTURED THEREBY, AND DISPLAY DEVICE COMPRISING SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Original Abstract Submitted
METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGE, SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGE MANUFACTURED THEREBY, AND DISPLAY DEVICE COMPRISING SAME
Organization Name
Inventor(s)
METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGE, SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGE MANUFACTURED THEREBY, AND DISPLAY DEVICE COMPRISING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18028606 titled 'METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGE, SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGE MANUFACTURED THEREBY, AND DISPLAY DEVICE COMPRISING SAME
Simplified Explanation
The patent application describes a method for manufacturing a semiconductor light emitting device package, as well as the package itself and a display device that includes it.
- The semiconductor light emitting device package includes several layers: a first semiconductor layer, a tether layer, a light emitting structure, a light-transmitting electrode layer, and a post structure.
- The first semiconductor layer is located on a growth substrate.
- The tether layer is situated on top of the first semiconductor layer.
- The light emitting structure is positioned on the tether layer.
- The light-transmitting electrode layer is placed on the light-emitting structure.
- The post structure is located on top of the light-transmitting electrode layer.
Original Abstract Submitted
Embodiments relate to a method for manufacturing a semiconductor light emitting device package, a semiconductor light emitting device package manufactured by the method, and a display device including the same. The semiconductor light emitting device package according to the embodiment can include a first semiconductor layer on a growth substrate, a tether layer on the first semiconductor layer, a light emitting structure on the tether layer, a light-transmitting electrode layer on the light-emitting structure, and a post structure on the light-transmitting electrode layer.
