US Patent Application 18004902. HEAT SINK WITH BULK HEAT ISOLATION simplified abstract
Contents
HEAT SINK WITH BULK HEAT ISOLATION
Organization Name
Telefonaktiebolaget LM Ericsson (publ)
Inventor(s)
[[Georg Hellstr�m of Stockholm (SE)]]
HEAT SINK WITH BULK HEAT ISOLATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18004902 titled 'HEAT SINK WITH BULK HEAT ISOLATION
Simplified Explanation
- The patent application describes a heatsink system that is used to dissipate heat from multiple heat generating components. - The heatsink system includes a base plate that is used to connect the heatsink system to the heat generating components. - One of the heat generating components is a first bulk heat source, and the heatsink system includes a first heatsink integrated thermosiphon that is specifically designed to dissipate heat from this first bulk heat source. - The heatsink system also includes one or more heat dissipating fins that are used to dissipate heat from the other heat generating components, excluding the first bulk heat source. - Importantly, the first heatsink integrated thermosiphon is thermally isolated from the one or more heat dissipating fins, meaning that they do not share the same thermal pathway. - This design allows for efficient heat dissipation from the different heat generating components, ensuring optimal cooling performance.
Original Abstract Submitted
According to some embodiments, a heatsink system comprises a base plate for thermally coupling the heatsink system to two or more heat generating components, wherein at least one of the heat generating components is a first bulk heat source. The heatsink system further comprises a first heatsink integrated thermosiphon coupled to the base plate at a location that dissipates heat from the first bulk heat source and one or more heat dissipating fins coupled to the base plate at a location that dissipates heat from the heat generating components other than the first bulk heat source. The first heatsink integrated thermosiphon is thermally isolated from the one or more heat dissipating fins.
